Intel’s Mike Lee Predicts 224Gbps I/O by 2024/5
The industry is preparing to ship 112 Gbps interconnect technologes with a view of designs that can reach 224 Gbps, according to Mike Lee, senior engineer, Intel.
Lee was speaking ahead of two presentations at the recent DesignCon 2021 in Santa Clara.
He told Informa Tech’s Chuck Martin he expected I/O speeds to double every three-to-four years – a longer timescale than Broadcom’s Cathy Liu has outlined.
But that still means 224 Gbps technologies could be here as soon as 2024 or 2025 to merge into technology use cases.
Lee and Liu both took part in a round table discussion of 224Gbps options organized by the Optical Internetworking Forum in June 2021.
Away from hard tech, Lee also reflected on how DesignCon has evolved, more than 20 years after the first edition of the high-speed digital interface symposium.
Check out the video for the full interview.