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December 5, 2023
Siemens has partnered with Intel on a new project to advance semiconductor manufacturing.
The partners will use IoT and automation solutions to advance semiconductor manufacturing efficiency and sustainability, with a focus on factory connectivity and cybersecurity.
“Semiconductors are the lifeblood of our modern economies,” said Cedrik Neike, Siemens’ CEO of digital industries. “Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production.
“Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration. Our joint efforts will contribute to achieving global sustainability goals.”
Key areas of collaboration will include optimizing energy management and addressing carbon footprints “across the value chain,” using advanced natural resource and environmental footprint modeling.
The pair will also explore digital twin technology under the partnership to create smart, efficient manufacturing facilities.
“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” said Keyvan Esfarjani, Intel’s executive vice president. “We are excited to … explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities and factory operations. This MOU will benefit regional and global industry value chains.”
Assistant Editor, IoT World Today
Scarlett Evans is the assistant editor for IoT World Today, with a particular focus on robotics and smart city technologies. Scarlett has previous experience in minerals and resources with Mine Australia, Mine Technology and Power Technology. She joined Informa in April 2022.
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