Bois Talks 5G Edge and Interconnects
Karl Bois, a systems architect at Switzerland-headquartered interconnect supplier TE Connectivity, spoke to IoTWT’s parent Informa Tech at DesignCon 2021.
Bois said that stronger edge interconnects were inevitable to support 5G connectivity in an interview with Chuck Martin, editorial director of AI and IoT.
“Something has to aggregate all that content. So the 5G content may have exploded, but that content must then be corralled,” Bois said.
He referred to the current state of play, which poses more challenges in terms of designing each interconnect’s electrical and mechanical functions.
Bois also explains why he thinks his part of the ecosystem is so special, based on more than 21 years in the interconnect industry. See below for the full interview.